恩法半体由原 ST、Ericsson 及 NXP 之手机部门合而成，目前由ST、Ericsson 各占一半之股，品主要以手机主，跨 2G, 3G, 3.5G 平台，2G, 3G, 3.5G Modem card 以及手机相外零件，次于 Qualcom 之手机平台供商。
|
|
| |
Application Specific Controller |
| |
Bluetooth |
| |
Card Reader |
| |
CPU |
| |
Demodulator |
| |
DSP |
| |
GPS Navigator / Receiver |
| |
LAN |
| |
Micro Controller(MCU) |
| |
MODEM/FAX |
| |
MP3 SoC |
| |
PC Chipset |
| |
Power Management IC |
| |
RF PA |
| |
RF PA Module |
| |
Telecom IC |
| |
UWB |
| |
Video IC |
| |
WLAN |
| |
Zigbee | |
ST-Ericsson